Data set 01
1966 Tung Sol Electronic Tubes 1 of 4
Published operating points and test conditions from this source.
Diode
Characteristic
PLATE TO HEATER &CATHODE &INTERNAL SHIELD
3 pF
Diode Unit | PLATE TO HEATER &CATHODE &INTERNAL SHIELD 3.0 pf
Pentode
Characteristic
PENTODE GRID TO DIODE PLATE (MAX.)
0.005 pF
Pentode Unit | PENTODE GRID TO DIODE PLATE (MAX.) 0.005 pf
PENTODE PLATE TO DIODE CATHODE (MAX.)
0.15 pF
Pentode Unit | PENTODE PLATE TO DIODE CATHODE (MAX.) 0.15 pf
PENTODE PLATE TO DIODE PLATE (MAX.)
0.1 pF
Pentode Unit | PENTODE PLATE TO DIODE PLATE (MAX.) 0.10 pf
POSITIVE BIAS VALUE
0 V
Pentode Unit | POSITIVE BIAS VALUE 0 VOLTS
CATHODE BIAS OPERATION
1 Mohm
Pentode Unit | CATHODE BIAS OPERATION 1.0 MEGOHM
FIXED BIAS OPERATION
0.25 Mohm
Pentode Unit | FIXED BIAS OPERATION 0.25 MEGOHM
Other
HEATER WARM-UP TIME APPROX
11 s
Average Characteristics | HEATER WARM-UP TIME APPROX. 11 SECONDS
LIMITS OF SUPPLIED CURRENT
40 mA
Average Characteristics | LIMITS OF SUPPLIED CURRENT 600 ± 40 MA
HEATER NEGATIVE WITH RESPECT TO CATHODE
200 V
Average Characteristics | HEATER NEGATIVE WITH RESPECT TO CATHODE 200 VOLTS
MAXIMUM PLATE VOLTAGE
300 V
Pentode Unit | MAXIMUM PLATE VOLTAGE 300 VOLTS
MAXIMUM GRID p
0 V
Pentode Unit | MAXIMUM GRID p3 VOLTAGE 0 VOLTS
MAXIMUM GRID it
300 V
Pentode Unit | MAXIMUM GRID it2 SUPPLY VOLTAGE 300 VOLTS
MAXIMUM PLATE DISSIPATION
2.5 W
Pentode Unit | MAXIMUM PLATE DISSIPATION 2.5 WATTS
MAXIMUM GRID k
0.5 W
Pentode Unit | MAXIMUM GRID k2 INPUT 0.5 WATT
MAXIMUM PEAK INVERSE PLATE VOLTAGE
330 V
Pentode Unit | MAXIMUM PEAK INVERSE PLATE VOLTAGE 330 VOLTS
MAXIMUM PEAK PLATE CURRENT
50 mA
Pentode Unit | MAXIMUM PEAK PLATE CURRENT 50 MA
MAXIMUM DC PLATE CURRENT
5 mA
Pentode Unit | MAXIMUM DC PLATE CURRENT 5 MA
PLATE SUPPLY VOLTAGE
200 V
Typical Operating Conditions | PLATE SUPPLY VOLTAGE 200 VOLTS
GRID k
150 V
Typical Operating Conditions | GRID k2 SUPPLY VOLTAGE 150 VOLTS
CATHODE BIAS RESISTOR
160 ohm
Typical Operating Conditions | CATHODE BIAS RESISTOR 160 OHMS
PLATE CURRENT
9.5 mA
Typical Operating Conditions | PLATE CURRENT 9.5 MA
GRID b
3 mA
Typical Operating Conditions | GRID b2 CURRENT 3 MA
TRANSCONDUCTANCE
6.2 ΜMHOS
Typical Operating Conditions | TRANSCONDUCTANCE 6.200 µMHOS
PLATE RESISTANCE (APPRO X.)
300 ohm
Typical Operating Conditions | PLATE RESISTANCE (APPRO X.) 300.000 OHMS
GRID qI BI AS (APPROX.) FOR I y
8 V
Typical Operating Conditions | GRID qI BI AS (APPROX.) FOR I y =10µA —8 VOLTS
GRID
2 V
Typical Operating Conditions | GRID 2 VOLTS
